Vacuum Deposition
Thermal Evaporation
Magnetron Sputtering
Arc & Ion
 
 
  Thermal Evaporation
 
Evaporation Deposition
Evaporation is a common method of thin film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state.

Evaporation takes place in a vacuum, vapors other than the source material are almost entirely removed before the process begins. In high vacuum, evaporated particles can travel directly to the deposition target without colliding with the background gas. Hot objects in the evaporation chamber, such as heating filaments, produce unwanted vapors that limit the quality of the vacuum.

Electron Beam Evaporation
An electron beam evaporator fires a high-energy beam from an electron gun to boil a small spot of material; since the heating is not uniform, lower vapor pressure materials can be deposited. The beam is usually bent through an angle of 270¡ã in order to ensure that the gun filament is not directly exposed to the evaporant flux. Typical deposition rates for electron beam evaporation range from 1 to 10 nanometers per second.

Optimization
Evaporation systems may be judged by the following qualities:
* Purity of the deposited film depends on the quality of the vacuum, and on the purity of the source material.
* The thickness of the film will vary due to the geometry of the evaporation chamber. Collisions with residual gases aggravate nonuniformity of thickness.
* Filament and resistive evaporation cannot deposit thick films, because the size of the filament limits the amount of material that can be deposited. However, flash evaporation and methods that use crucibles can deposit thick films.
* In order to deposit a material, the evaporation system must be able to melt it. This makes refractory materials such as tungsten hard to deposit by methods that do not use electron-beam heating.
* Electron-beam evaporation allows tight control of the evaporation rate. Thus, an electron-beam system with multiple beams and multiple sources can deposit a chemical compound or composite material of known composition.
* Step coverage

Applications
An important example of an evaporative process is the production of aluminized PET film packaging film in a roll-to-roll web system. Often, the aluminum layer in this material is not thick enough to be entirely opaque since a thinner layer can be deposited more cheaply than a thick one. The main purpose of the aluminum is to isolate the product from the external environment by creating a barrier to the passage of light, oxygen, or water vapor.

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